|
Max. no of built up layer
|
1 on each side (1+n+1)
|
|
Layer of sub-core
|
>2L
|
|
Thk. Of sub-core (mil)
|
24-80
|
|
Min. Line spacing of inner
layer/sub-core (mil)
|
3/4
|
|
Min. Line spacing of built up
layer (mil)
|
3.5/3.5
|
|
Min. through hole size, (drill
size in mil)
|
12
|
|
Built up material (1 ply)
|
RCC, 106 and 1080 (FR-4 erferable)
|
|
Built up layer thickness
|
Not over 2.5 mil
|
|
Overall thickness of the board
(mil)
|
32-128
|
|
Max. panel size
|
18"x24"
|
|
Surface Finsih
|
ENIG, Entek, No HSAL, No selective
|
|
Min. buried via size (mil)
|
12
|