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Item

Content

Capacity

1

Layer Count

2-30

2

Panel Size(Max)

24.2"×30.2"

3

Panel Size(Min)

12"×12"(I-Ag, OSP: 4"×6")

4

Board Thickness(Max)

 8.0mm(I-Ag,OSP:5.0mm,ENIG:4.5mm)

5

Board Thickness(Min)

0.4mm

6

Thin Core Thickness(Min)

3mil

7

Finished Board Thickness Tolerance(Board Thickness≥0.8mm)

±10%

8

Finished Board Thickness Tolerance(0.4mm≤Board Thickness<0.8mm)

±3mil

9

Warpage(Min)

0.7%

10

Drill Size(Max)

Φ6.7mm

11

Drill Size(Min)

Φ0.20mm

12

Base Copper Thickness of Outer Layer(Min)

1/3 OZ

13

Base Copper Thickness of Outer Layer(Max)

4 OZ

14

Base Copper Thickness of inner Layer(Min)

1/3 OZ

15

Base Copper Thickness of inner Layer(Min)

3 OZ

16

Dielectric Thickness(Min)

2mil

17

Laminate Type

Tg135℃ FR-4  S1141、Tg150℃ FR-4  S1000、Tg170℃ FR-4  S1000-2、羅杰斯R系列、聚四氟乙烯系列

18

Aspect Ratio(Max)

12:1

19

Hole Diameter Tolerance(PTH)

±2mil

20

Hole Diameter Tolerance(NPTH)

±1mil

21

Hole Position Tolerance(Compared with CAD Data)

±2mil

22

Holewall Copper Thickness(Full Hole)

≥1mil

23

Holewall Copper Thickness(Blind Via)

≥0.6mil

24

Line Width/Spacing of Outer Layer(Min)

T/T OZ: 3mil/3mil、H/H OZ: 4mil/4mil

1/1 OZ: 6mil/6mil、2/2 OZ: 8mil/8mil

3/3 OZ: 10mil/10mil

25

Line Width/Spacing of Inner Layer(Min)

H/H OZ: 3mil/3mil、1/1 OZ: 3mil/3mil

2/2 OZ: 6mil/6mil、3/3 OZ:  8mil/8mil

26

Etching Tolerance

±20%

27

Image to Image Tolerance(Min)

±5mil

28

Outer Image to Hole Tolerance(Min)

±3mil

29

Outer Image to Edge Tolerance(Min)

±6mil

30

Hole to Hole Tolerance(Min)

±2mil

31

Solder Mask Registration Tolerance

±2mil

32

Solder Mask Thickness(Min)

10μm

33

Solder Mask Bridge Width(Min)

2.5mil

34

Solder Mask Plugged Hole Diameter

Φd>0.75mm: Solder in Hole

Φd≤0.75mm:No Solder Ball in Hole

35

Minimum Nickel Thickness of ENIG(Max)

4.0μm

36

Minimum Gold Thickness of ENIG(Max)

0.05μm

37

Solder Thickness on XFP (HAL) (Max)

25.4μm

38

Solder Thickness except XFP (HAL) (Min)

2.54μm

39

Routing Dimension Tolerance(Edge to Edge)(Min)

±4mil

40

Routing Dimension Tolerance(Hole to Edge)(Min)

±4mil

41

Radius by Routing (Internal Angle)(Min)

R≥0.4mm

42

Countersink Hole Size(Top Angle is 165°)(Max)

6.35mm

43

Slot Width（Min）

0.5mm

44

Slot Tolerance（PTH）（L≥2W+0.15mm）

±0.076mm

45

Slot Tolerance(PTH）（L<2W+0.15mm）

±0.076mm

46

V-CUT Remaining Thickness Tolerance(MIN)

±0.05mm

47

V-CUT Angle Tolerance(30°- 60°）(Min)

±4°

48

V-CUT MISREGISTRATION （MIN）

±3mil

49

V-CUT Board Thickness(Min/Max）

0.5mm/2.4mm

50

V-CUT to Hole Tolerance(Min)

±5mil

51

V-CUT to V-CUT Location tolerance(Min)

±4mil

52

V-CUT to Edge Tolerance(Min)

±5mil

53

Impedance Tolerance(Min)

±7%

54

Minimum Tin Thickness of Immersion Tin

1.0μm

55

Nickel Thickness of Gold Finger Plating

2.54-7.62μm

56

Gold Thickness of Gold Finger Plating

0.25-0.8μm

57

Film Thickness of OSP

100-200u"

58

Gold Finger Chamfer Angle Tolerance

2°

59

Gold Finger Chamfer Depth Tolerance

±5mil