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Item

Content

Capacity

1

Layer Count

2-30

2

Panel Size(Max)

24.2"¡Á30.2"

3

Panel Size(Min)

12"¡Á12"(I-Ag, OSP: 4"¡Á6")

4

Board Thickness(Max)

 8.0mm(I-Ag,OSP:5.0mm,ENIG:4.5mm)

5

Board Thickness(Min)

0.4mm

6

Thin Core Thickness(Min)

3mil

7

Finished Board Thickness Tolerance(Board Thickness¡Ý0.8mm)

¡À10%

8

Finished Board Thickness Tolerance(0.4mm¡ÜBoard Thickness<0.8mm)

¡À3mil

9

Warpage(Min)

0.7%

10

Drill Size(Max)

¦µ6.7mm

11

Drill Size(Min)

¦µ0.20mm

12

Base Copper Thickness of Outer Layer(Min)

1/3 OZ

13

Base Copper Thickness of Outer Layer(Max)

4 OZ

14

Base Copper Thickness of inner Layer(Min)

1/3 OZ

15

Base Copper Thickness of inner Layer(Min)

3 OZ

16

Dielectric Thickness(Min)

2mil

17

Laminate Type

Tg135¡æ FR-4  S1141¡¢Tg150¡æ FR-4  S1000¡¢Tg170¡æ FR-4  S1000-2¡¢Á_½Ü˹RϵÁС¢¾ÛËÄ·úÒÒϩϵÁÐ

18

Aspect Ratio(Max)

12:1

19

Hole Diameter Tolerance(PTH)

¡À2mil

20

Hole Diameter Tolerance(NPTH)

¡À1mil

21

Hole Position Tolerance(Compared with CAD Data)

¡À2mil

22

Holewall Copper Thickness(Full Hole)

¡Ý1mil

23

Holewall Copper Thickness(Blind Via)

¡Ý0.6mil

24

Line Width/Spacing of Outer Layer(Min)

T/T OZ: 3mil/3mil¡¢H/H OZ: 4mil/4mil

1/1 OZ: 6mil/6mil¡¢2/2 OZ: 8mil/8mil

3/3 OZ: 10mil/10mil

25

Line Width/Spacing of Inner Layer(Min)

H/H OZ: 3mil/3mil¡¢1/1 OZ: 3mil/3mil

2/2 OZ: 6mil/6mil¡¢3/3 OZ:  8mil/8mil

26

Etching Tolerance

¡À20%

27

Image to Image Tolerance(Min)

¡À5mil

28

Outer Image to Hole Tolerance(Min)

¡À3mil

29

Outer Image to Edge Tolerance(Min)

¡À6mil

30

Hole to Hole Tolerance(Min)

¡À2mil

31

Solder Mask Registration Tolerance

¡À2mil

32

Solder Mask Thickness(Min)

10¦Ìm

33

Solder Mask Bridge Width(Min)

2.5mil

34

Solder Mask Plugged Hole Diameter

¦µd>0.75mm: Solder in Hole

¦µd¡Ü0.75mm:No Solder Ball in Hole

35

Minimum Nickel Thickness of ENIG(Max)

4.0¦Ìm

36

Minimum Gold Thickness of ENIG(Max)

0.05¦Ìm

37

Solder Thickness on XFP (HAL) (Max)

25.4¦Ìm

38

Solder Thickness except XFP (HAL) (Min)

2.54¦Ìm

39

Routing Dimension Tolerance(Edge to Edge)(Min)

¡À4mil

40

Routing Dimension Tolerance(Hole to Edge)(Min)

¡À4mil

41

Radius by Routing (Internal Angle)(Min)

R¡Ý0.4mm

42

Countersink Hole Size(Top Angle is 165¡ã)(Max)

6.35mm

43

Slot Width£¨Min£©

0.5mm

44

Slot Tolerance£¨PTH£©£¨L¡Ý2W+0.15mm£©

¡À0.076mm

45

Slot Tolerance(PTH£©£¨L<2W+0.15mm£©

¡À0.076mm

46

V-CUT Remaining Thickness Tolerance(MIN)

¡À0.05mm

47

V-CUT Angle Tolerance(30¡ã- 60¡ã£©(Min)

¡À4¡ã

48

V-CUT MISREGISTRATION £¨MIN£©

¡À3mil

49

V-CUT Board Thickness(Min/Max£©

0.5mm/2.4mm

50

V-CUT to Hole Tolerance(Min)

¡À5mil

51

V-CUT to V-CUT Location tolerance(Min)

¡À4mil

52

V-CUT to Edge Tolerance(Min)

¡À5mil

53

Impedance Tolerance(Min)

¡À7%

54

Minimum Tin Thickness of Immersion Tin

1.0¦Ìm

55

Nickel Thickness of Gold Finger Plating

2.54-7.62¦Ìm

56

Gold Thickness of Gold Finger Plating

0.25-0.8¦Ìm

57

Film Thickness of OSP

100-200u"

58

Gold Finger Chamfer Angle Tolerance

2¡ã

59

Gold Finger Chamfer Depth Tolerance

¡À5mil